BERGQUIST GAP TGF 1500粘胶剂

BERGQUIST GAP FILLER TGF 1500 is a high-performance, two-part thermally conductive gap filler engineered to deliver dependable heat transfer for power electronics and compact assemblies used in aerospace, defence, industrial and automotive applications.With a thermal conductivity of 1.5 W/m-K, it provides enhanced thermal efficiency for demanding environments.

The material cures at room temperature and offers excellent compliance, minimising mechanical stress on sensitive components.Its dispensable formulation ensures good wet-out and uniform coverage, making it suitable for assemblies with variable gaps or complex geometries.

BERGQUIST GAP FILLER TGF 1500 is formulated to operate reliably across wide temperature ranges and is commonly used where long-term stability and reliable thermal performance are essential.The material supports both manual and automated dispensing processes, enabling integration into high-volume production workflows.

Two-part thermally conductive gap filler

Thermal conductivity: 1.5 W/m-K

Room-temperature curing with accelerated options available

Soft, compliant cured interface reduces mechanical stress

Excellent wet-out for uniform thermal contact

Compatible with automated or manual dispensing

Suitable for high-reliability aerospace, defence, and industrial electronics