光纤激光划片机纽扣激光划片机工艺品激光划片机

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光纤激光划片机系列
Fiber laser scribing-cell machine series
SFS10 / SFS20

设备性能
在具备氪灯泵浦YAG激光划片机所有性能优点的基础上，还具有以下特点：
1、光束质量更好（标准基模）、切缝更细（10μm）、边缘更平整光滑；
2、转换效率更高、运行成本更低（1kVA）；
3、真正免维护、不间断连续运行、无消耗性易损件更换；
4、设备体积更小（风冷）。

应用领域
太阳能行业单晶硅、多晶硅、非晶硅带太阳能电池片（cell）和硅片（wafer）的划片（切割切片）。

主要技术参数
型号规格 SFS10 SFS20
激光波长 1.064μm
激光最大功率 ≥10W ≥20W
激光重复频率 20kHz~200kHz
划片线宽 ≤10μm
最大划片速度 140mm/s
划片精度 ≤±10μm
工作台幅面 350×350mm
工作电源 220V/50Hz/1kVA
工作台 双气仓真空吸附，T型台双工位交替工作
冷却方式 强迫风冷






Equipment Performance:
It has all performance merit of the YAG laser Krypton lamp scriber machine in foundation, it has other characteristics as follows:
1. Better quality of speed of light (standard machine mold), finer seam (10μm), more smooth of the edge;
2. Higher transfer efficiency, lower running cost (1KVA) ;
3. Exact free of maintain, the uninterrupted continuous running, no consumptive and vulnerable replacement;
4. Smaller equipment volumes (forced-air cooling).

Application fields
Scribing for mono-crystalline sillicon, poly-crystalline sillicon, amorphous-crystallinesillicon, solar cell, wafer in solar industry.

The main technical parameters
Type specification SFS10 SFS20
Laser wavelength 1.064μm
Laser max power ≥10W ≥20W
Laser repetition frequency 20kHz~200kHz
Scriber line width ≤10μm
Max scriber speed 140mm/s
Scriber precision ≤±10μm
Work platform size 350×350mm
Power supply 220V/50Hz/1kVA
Work platform The adsorption of double gas warehouse vacuum, the T model platform is double position works in turn
Cooling way Forced-air cooling